CMP Technology: Competition, Products, Markets
Chapter 1 Introduction 1-1
Chapter 2 Executive Summary 2-1
2.1 Introduction 2-1
2.2 Market Opportunities 2-9
Chapter 3 Planarization Methods 3-1
3.1 Need for Planarity 3-1
3.1.1 Lithography 3-4
3.1.2 Deposition 3-6
3.1.3 Etching 3-10
3.2 Applications 3-13
3.2.1 Dielectrics 3-13
3.2.2 Metals 3-15
3.3 Planarization Techniques 3-17
3.3.1 Local Planarization 3-17
3.3.1.1 Deposition-Etchback 3-17
3.3.1.2 ECR 3-19
3.3.1.3 Oxide Reflow 3-19
3.3.1.4 Spin-on-Glass 3-20
3.3.1.5 TEOS-Ozone 3-20
3.3.1.6 Laser 3-21
3.3.2 Global Planarization 3-22
3.3.2.1 Spin-On Polymer 3-22
3.3.2.2 Polyimide Coating 3-24
3.3.2.3 Isotropic Etch 3-24
3.3.2.4 Spin Etch Planarization 3-25
3.3.2.5 Electropolishing 3-26
3.4 CMP 3-28
3.4.1 Background 3-33
3.4.2 Research Efforts 3-34
3.4.3 Advantages and Disadvantages 3-35
3.4.4 Process Parameters 3-37
3.4.4.1 STI Planarization 3-39
3.4.4.2 Copper CMP 3-43
3.4.4.3 Low-K Integration 3-57
3.4.4.4 Defect Density 3-69
3.4.4.5 Metrology 3-71
3.4.5 Device Processing Parameters 3-85
3.4.5.1 Memory Devices 3-85
3.4.5.2 Logic Devices 3-86
Chapter 4 CMP Consumables 4-1
4.1 Slurries 4-1
4.1.1 Types 4-1
4.1.2 pH Effects 4-7
4.1.3 Oxidizers 4-10
4.1.4 Particle Morphology Effects 4-11
4.1.5 Chemical Distribution Management 4-13
4.1.6 Slurry Supplier Profiles 4-18
4.1.7 Abrasive Suppliers 4-32
4.2 Post-CMP Clean 4-36
4.3 Polishing Pads 4-42
4.3.1 Types 4-42
4.3.2 Performance 4-43
4.3.3 Slurryless Pads 4-49
Chapter 5 CMP Equipment 5-1
5.1 Single-Head Approach 5-1
5.1.1 Advantages 5-1
5.1.2 Disadvantages 5-3
5.2 Multi-Head Approach 5-4
5.2.1 Advantages 5-4
5.2.2 Disadvantages 5-5
5.3 Equipment Profiles 5-6
5.3.1 Applied Materials 5-7
5.3.2 Ebara 5-8
5.3.3 Strasbaugh 5-9
5.3.4 Novellus 5-9
5.3.5 Nikon 5-10
5.3.6 Doosan Mecatec 5-11
5.3.7 Other Entrants 5-11
5.4 Clustered Tools 5-12
5.5 Competitive Non-CMP Tools 5-15
Chapter 6 User Issues 6-1
6.1 Cost of Ownership 6-1
6.2 User Requirements 6-7
6.3 Benchmarking a Vendor 6-10
6.3.1 Pricing 6-10
6.3.2 Vendor Commitment and Attitudes 6-12
6.3.3 Vendor Capabilities 6-13
6.3.4 System Capabilities 6-15
6.4 User-Supplier Synergy 6-16
6.4.1 Feedback During Equipment Evaluation 6-16
6.4.2 Feedback During Device Production 6-17
6.5 Reliability 6-18
6.6 Equipment Maintainability 6-19
Chapter 7 Market Forecast 7-1
7.1 Introduction 7-1
7.2 Market Forecast Assumptions 7-4
7.3 Equipment Market 7-5
7.3.1 Introduction 7-5
7.3.2 CMP Polisher Market 7-6
7.4 Consumable Market 7-11
7.4.1 Slurry 7-11
7.4.2 Pads 7-21
LIST OF FIGURES
Page
1.1 Process Integration for CMP 1-2
3.1 Planarization Lengths of Various Methods 3-18
3.2 Normalized Removal Rates 3-29
3.3 Reduced Complexity With Copper 3-45
3.4 Copper Loss From CMP 3-50
3.5 CMP Copper Process Technologies 3-52
3.6 CMP Performance Improvements 3-54
3.7 Polish Endpoint Control 3-83
4.1 Effect of Nitrate Ions on the Cu Removal Rate 4-8
4.2 Removal Rate of Ta 4-9
4.3 Bulk Chemical Distribution System 4-15
4.4 Through The Brush Chemical Delivery 4-68
4.5 Megasonics Post-CMP Clean 4-40
4.6 Micrograph Of 3M Slurryless Pad 4-51
6.1 Effect of Tool MTBF on CMP Cost 6-5
6.2 Removal Rate Vs Throughput and CMP Cost 6-6
7.1 Worldwide CMP Polisher Market 7-8
7.2 Worldwide CMP Slurry Market Forecast 7-13
7.3 CMP Slurry Market by Application 7-15
7.4 ILD Slurry Market Share 7-16
7.5 STI Slurry Market Share 7-17
7.6 Copper Barrier Slurry Market Share 7-18
7.7 Copper Step 1 Slurry Market Share 7-19
7.8 Worldwide CMP Pad Market Forecast 7-23
7.9 CMP PAD Market Shares 7-24
LIST OF TABLES
Page
3.1 Levels of Integration of Dynamic Rams 3-2
3.2 Interconnect Levels of Logic Device 3-3
3.3 Typical Process Specifications 3-12
3.4 Organic Polymers for IMD Applications 3-23
3.5 CMP Process Variables 3-31
3.6 Optimized CMP and Post-CMP Clean Parameters 3-39
3.7 Interconnect Materials by Segment 3-48
4.1 CMP Slurry Suppliers 4-19
4.2 Abrasive Suppliers and Products 4-35
4.2 Oxide CMP Pad Properties and Performance 4-44
6.1 Polisher Equipment Targets 6-8
6.2 Post-CMP Clean Equipment Targets 6-9
7.1 Worldwide CMP Polisher Market Forecast 7-7
7.2 Worldwide CMP Polisher Market Shares 7-10
7.3 Worldwide CMP Slurry Market Forecast 7-12
7.4 Worldwide Slurry Market Shares 7-14
7.5 Worldwide CMP Pad Market Forecast 7-22
